Reliability Considerations of Flip Chip Components for Automotive Electronic Applications
نویسندگان
چکیده
منابع مشابه
Reliability Considerations for Automotive FPGAs
With the increasing deployment of electronics in automobiles, the need for high reliability components is essential to ensure the proper function of the systems in today's vehicles. While there has been substantial progress made in this area, there are still many engineering trade-offs that are poorly understood, which should be factored into the selection process for advanced digital circuits....
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In order to successfully implement reliable Flip Chip packaging technology, it is desirable to ensure solder fatigue as the limiting mechanical failure mechanism. Doing so enables the packaging engineer to design to specific reliability standards, as solder fatigue is a known and predictable failure mechanism. Indeed, other Flip Chip failure modes such as silicon fracture and underfill delamina...
متن کاملAnalysis of Solder Joint Reliability in Flip Chip Packages
Fatigue damage of solder joints is a serious reliability concern in electronic packaging. In this study, a flip chip package was modeled to investigate the effects of underfill material properties and BT substrate thickness on solder joint reliability. The CTE was found to have the main effect and matching CTE between underfill and solder joint is the most important consideration in the selecti...
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A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package size, 15 to 25 mm in die size, and 672 to 1020 in ball count. With dies and packages so large, solder joint fatigue failure and underfill delamination, induced by thermal expansion mismatch, are a major concern. Finite element analysis was set up for efficient reliability analysis....
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Probe-after-bump is the primary probing procedure for flip chip technology, since it does not directly contact the bump pad, and involves a preferred under bump metallurgy (UBM) step coverage on the bump pads. However, the probe-after-bump procedure suffers from low throughputs and high cost. It also delays the yield feedback to the fab, and makes difficult clarification of the accountability o...
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ژورنال
عنوان ژورنال: ElectroComponent Science and Technology
سال: 1981
ISSN: 0305-3091
DOI: 10.1155/apec.9.87